Konferencia SiP Čína

Konferencia SiP Čína

SiP Conference China. WELCOME FROM GENERAL CHAIR. The conference will cover the following vital topics. ● SiP Assembly & Test. ● SiP Design Solutions. ● SiP System Solutions. ● SiP Heterogeneous Integration. ● SiP Substrate Solutions. ● Advanced in SiP Material and interconnect Technology. ● Test & Design Solutions. ● Advancement in Assembly SiP Equipment. ● Advanced in SiP Material and interconnect Technology.

Advancements in System-in-Package (SiP) packaging landscape during the past few years have brought many new solutions and techniques along with sophisticated system integration methodologies for better electrical, mechanical and thermal performances. The advancement in SiP assembly, test and material forms the heart and soul of the new generation of SiP platforms.

This conference and the exhibition will highlight new advancement in SiP technologies that are helping to implement size reduced and cost-effective solutions for high data rate wireless 5G technology to cover a wide spectrum of application such as 5G-NR cellular, IoT, autonomous vehicles, Artificial Intelligent (AI), data storage, computing and networking.

SiP Conference China 2021 will feature two days of keynote speeches and technical presenters covering SiP technology and business trends from OSATs, test providers, material suppliers, system houses, research and development industries. Given the current global COVID-19 consideration, a few of the keynotes and the presentations will be conducted virtually either through live or recorded Webinars.